Optical encoder and its manufacturing method

ABSTRACT

An optical encoder comprises a sensor head including a light source and a photodetector and a scale that moves relative to the sensor head. The light emitted from the light source is reflected, transmitted or diffracted by the scale, and the reflected, transmitted or diffracted light is received by the photodetector to allow the sensor head to output a displacement signal. The sensor head includes a wiring substrate having electrodes formed thereon and on which the light source and photodetector are disposed at predetermined positions and a light transmitting material that covers the wiring substrate, light source, and photodetector. A side plane obtained by cutting the wiring substrate and light transmitting material at the same time in the direction substantially perpendicular to the light receiving surface of the photodetector serves as a reference position related to disposition of the components to be mounted on the wiring substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.11/083,207 filed Mar. 17, 2005 which is based upon and claims thebenefit of priority from prior Japanese Patent Application No.2004-100438, filed Mar. 30, 2004, the entire contents of each of whichare incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an optical encoder that detects theposition or the like of an object to be detected and its manufacturingmethod.

2. Description of the Related Art

Various types of optical encoders that detect the position of an objectto be detected have been proposed.

For example, Jpn. Pat. Appln. KOKAI Publication No. 2000-321018 (U.S.Pat. No. 6,410,911 B1) discloses an optical encoder including a sensorhead having the following configuration. That is, the sensor headincludes an LED chip serving as a light source, a scale having a gratingpattern that transmits or reflects light emitted from the LED chip, anda light-sensitive chip serving as a photodetector that receives thelight transmitted through or reflected by the scale. The light-sensitivechip and LED chip are mounted on a lead frame and are then integrallymolded in transparent resin, thereby obtaining a small-sized andthin-type sensor head.

In an optical encoder, the scale having a grating pattern movesrelatively to the above sensor head, thereby obtaining a displacementsignal from the sensor head. The displacement signal is a two-phaseanalog signal having phases different by 90 degrees or a digital signalobtained by converting the above analog signal in a signal processingcircuit, and periodically changes with the relative movement between thescale and sensor head.

BRIEF SUMMARY OF THE INVENTION

According to a first aspect of the present invention, there is providedan optical encoder comprising:

a sensor head including:

-   -   at least one light source;    -   at least one photodetector having a light receiving surface;    -   a wiring substrate having electrodes formed thereon and on which        the light source and photodetector are disposed at predetermined        positions; and    -   a light transmitting material that covers the wiring substrate,        the light source and the photodetector, wherein at least one of        side planes obtained by cutting the wiring substrate and light        transmitting material at the same time in the direction        substantially perpendicular to the light receiving surface of        the photodetector serves as a reference position related to        disposition of the components to be mounted on the wiring        substrate; and

a scale that moves relative to the sensor head, wherein the lightemitted from the light source is reflected, transmitted or diffracted bythe scale, and the reflected, transmitted or diffracted light isreceived by the photodetector to allow the sensor head to output adisplacement signal.

According to a second aspect of the present invention, there is providedan optical encoder comprising:

a sensor head including:

-   -   at least one light source;    -   at least one photodetector having a light receiving surface;    -   a wiring substrate having electrodes formed thereon and on which        the light source and photodetector are disposed at predetermined        positions;    -   a light transmitting material disposed above the light source;    -   another light transmitting material disposed above the        photodetector; and    -   an insulating material that covers at least the area including        the photodetector and wiring materials electrically connected to        the wiring substrate, wherein at least one of side planes        obtained by cutting the wiring substrate and insulating material        at the same time in the direction substantially perpendicular to        the light receiving surface of the photodetector serves as a        reference position related to disposition of the components to        be mounted on the wiring substrate; and

a scale that moves relative to the sensor head, wherein the lightemitted from the light source is reflected, transmitted or diffracted bythe scale, and the reflected, transmitted or diffracted light isreceived by the photodetector to allow the sensor head to output adisplacement signal.

According to a third aspect of the present invention, there is provideda method of manufacturing an optical encoder including a sensor headhaving at least one light source, at least one photodetector having alight receiving surface, and a scale that moves relative to the sensorhead, in which the light emitted from the light source is reflected,transmitted or diffracted by the scale, and the reflected, transmittedor diffracted light is received by the photodetector to allow the sensorhead to output a displacement signal, the method comprising:

forming a reference cutting-plane line on the substrate;

disposing the light source, photodetector, electrically functionalcomponents for driving and controlling the light source andphotodetector with the reference cutting-plane line as a reference;

forming a light transmitting material in such a manner to cover thesubstrate, light source, photodetector, and at least a part of thereference cutting-plane line; and

cutting the substrate and light transmitting material at the same timein the direction perpendicular to the light receiving surface of thephotodetector along the reference cutting-plane line, the cross-sectionof the light transmitting material being used as a side plane of thesensor head.

According to a fourth aspect of the present invention, there is provideda method of manufacturing an optical encoder including a sensor headhaving at least one light source, at least one photodetector having alight receiving surface, and a scale that moves relative to the sensorhead, in which the light emitted from the light source is reflected,transmitted or diffracted by the scale, and the reflected, transmittedor diffracted light is received by the photodetector to allow the sensorhead to output a displacement signal, the method comprising:

forming a reference cutting-plane line on the substrate;

disposing the light source, photodetector, electrically functionalcomponents for controlling and driving the light source andphotodetector with the reference cutting-plane line as a reference;

forming a light transmitting material in such a manner to cover at leasta part of the area including the substrate, light source, andphotodetector;

forming an insulating material in such a manner to cover a part of theelectrically functional components and at least a part of the referencecutting-plane line; and

cutting the substrate and insulating material at the same time in thedirection substantially perpendicular to the light receiving surface ofthe photodetector along the reference cutting-plane line, thecross-section of the insulating material being used as a side plane ofthe sensor head.

Advantages of the invention will be set forth in the description whichfollows, and in part will be obvious from the description, or may belearned by practice of the invention. Advantages of the invention may berealized and obtained by means of the instrumentalities and combinationsparticularly pointed out hereinafter.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

The accompanying drawings, which are incorporated in and constitute apart of the specification, illustrate embodiments of the invention, andtogether with the general description given above and the detaileddescription of the embodiments given below, serve to explain theprinciples of the invention.

FIG. 1 is a perspective view showing the configuration of an opticalencoder according to a first embodiment of the present invention;

FIG. 2 is a side view showing the configuration of a sensor head of theoptical encoder according to the first embodiment;

FIG. 3 is a plan view of a large-sized substrate showing disposition ofcomponents on the substrate to help explain a manufacturing method ofthe sensor head according to the first embodiment;

FIG. 4 is a cross-sectional view taken along A-A′ line of thelarge-sized substrate shown in FIG. 3 in the case where a lighttransmitting material is formed by molding;

FIG. 5 is a cross-sectional view taken along A-A′ line of thelarge-sized substrate shown in FIG. 3 in the case where a lighttransmitting material is formed by potting;

FIG. 6 is a perspective view showing the configuration of an opticalencoder according to a second embodiment of the present invention;

FIG. 7 is a side view showing the configuration of a sensor head of theoptical encoder according to the second embodiment;

FIG. 8 is a perspective view showing the configuration of an opticalencoder according to a third embodiment of the present invention;

FIG. 9 is a side view showing the configuration of a sensor head of theoptical encoder according to the third embodiment;

FIG. 10 is a perspective view showing the configuration of an opticalencoder according to a fourth embodiment of the present invention;

FIG. 11 is a side view showing the configuration of a sensor head of theoptical encoder according to the fourth embodiment;

FIG. 12 is a perspective view showing the configuration of an opticalencoder according to a fifth embodiment of the present invention;

FIG. 13 is a side view showing the configuration of a sensor head of theoptical encoder according to the fifth embodiment;

FIG. 14 is a perspective view showing the configuration of an opticalencoder according to a sixth embodiment of the present invention;

FIG. 15 is a side view showing the configuration of a sensor head of theoptical encoder according to the sixth embodiment;

FIG. 16 is a plan view of a large-sized substrate showing disposition ofcomponents on the substrate to help explain a manufacturing method ofthe sensor head according to the sixth embodiment;

FIG. 17 is a cross-sectional view taken along B-B′ line of thelarge-sized substrate shown in FIG. 16;

FIG. 18 is a perspective view showing the configuration of an opticalencoder according to a seventh embodiment of the present invention;

FIG. 19 is a side view showing the configuration of a sensor head of theoptical encoder according to the seventh embodiment;

FIG. 20 is a perspective view showing the configuration of an opticalencoder according to an eighth embodiment of the present invention; and

FIG. 21 is a side view showing the configuration of a sensor head of theoptical encoder according to the eighth embodiment.

DETAILED DESCRIPTION OF THE INVENTION

Preferred embodiments of the present invention will be described belowwith reference to the accompanying drawings.

First Embodiment

As shown in FIG. 1, an optical encoder according to the first embodimentis a reflective optical encoder including a sensor head 100 having alight source 102 and a photodetector 104 inside thereof, and a scale 200having a grating pattern and configured to move in a straight linerelative to the sensor head 100.

The sensor head 100 includes, as shown in FIGS. 1 and 2, a wiringsubstrate 106 made of ceramics, resin, or the like having electrodes,the light source 102 such as an LED or semiconductor laser, and asemiconductor IC 108 having one or more photodetectors 104 formedthereon. The light source 102 and semiconductor IC 108 are mounted onthe wiring substrate 106. The light source 102 and semiconductor IC 108are electrically connected to surface electrodes 112 of the wiringsubstrate 106 by conductive wires 110 or the like. Each of the surfaceelectrodes 112 is electrically connected to a rear surface electrode 116of the wiring substrate 106 through a lead electrode 114. The entiresurface of the wiring substrate 106 including the light source 102,semiconductor IC 108, and conductive wires 110 is covered by a lighttransmitting material 118 such as transparent resin. The sensor head 100has a side plane 120 substantially perpendicular to the light receivingsurface of the photodetector 104 on the reference position related todisposition of the components mounted on the wiring substrate 106. Notethat hatching is used to illustrate the side plane 120 for cleardiscrimination in FIG. 1 (and FIGS. 6, 8, 10, 12, 14, 18, and 20). Thatis, the hatching in this case does not show a cross-section at all.

A method of manufacturing the optical encoder having the aboveconfiguration will next be described.

Firstly, a method of manufacturing the sensor head 100 will bedescribed.

As shown in FIG. 3, a number of electrodes (surface electrodes 112, leadelectrodes 114, and rear surface electrodes 116) of the wiring substrate106 are arranged in a matrix on a large-sized substrate 122 made ofceramics or resin with a reference cutting-plane line 124 set as areference position. Further, the components to be mounted on the wiringsubstrate 106, such as a light source 102 and semiconductor IC 108 aremounted at desired positions on the large-sized substrate 122 with thereference cutting-plane line 124 serving as a reference position. Forformation of the lead electrodes 114, a method in which through holesare drilled in the large-sized substrate 122 and conductive materialsare placed in the through holes is available, for example. The lightsource 102 and semiconductor IC 108 are electrically connected to thesurface electrodes 112 of the wiring substrate 106 by conductive wires110 or the like. In the case where electrodes are formed on the reverseside of the light source 102, they are electrically connected to thesurface electrodes 112 of the wiring substrate 106, by soldering orusing conductive paste.

Then, the light transmitting material 118 such as transparent resin isused to cover the light source 102, semiconductor IC 108, conductivewires 110, and wiring substrate 106. Various methods are available forformation of the light transmitting material 118. For example, the lighttransmitting material 118 can be formed by molding, as shown in FIG. 4,or by a potting process performed for each area of the sensor head 100,as shown in FIG. 5.

Finally, the large-sized substrate 122 is cut, together with the lighttransmitting material 118, along the reference cutting-plane line 124 inthe direction substantially perpendicular to the light receiving surfaceof the photodetector 104 formed on the semiconductor IC 108, therebyobtaining the sensor head 100 having the side plane 120.

The side plane 120 formed by the above manufacturing method serves asthe reference position for the components to be mounted on the wiringsubstrate 106.

An attachment between the sensor head 100 thus manufactured and scale200 having a grating pattern will next be described.

In the case where, for example, the photodetector 104 has a rectangularshape, and where an accurate displacement signal can be obtained in theencoder by arranging the long side of the photodetector 104 parallel tothe long side of the grating pattern of the scale 200, the semiconductorIC 108 is disposed such that the long side of the photodetector 104 isperpendicular to the reference cutting-plane line 124. The sensor head100 and scale 200 are then attached to each other such that an outerplane or alignment pattern perpendicular to the long side of the gratingpattern of the scale 200, which has been previously formed, and the sideplane 120 obtained by cutting along the reference cutting-plane line 124perpendicular to the long side of the photodetector 104 are aligned witheach other. With the configuration thus obtained, an accuratedisplacement signal can be obtained. The above position adjustment isperformed by visual inspection, image identification, or by contactingthe target component to an auxiliary member.

Next, effects of the first embodiment will be described.

The side plane 120 of the sensor head 100 serves as a reference planerelated to disposition of the components mounted on the wiring substrate106. Therefore, merely by adjusting the positional relationship betweenthe side plane 120 of the sensor 100 and scale 200, a satisfactorydisplacement signal can be obtained. This makes it easy to make theattachment between the sensor head 100 and scale 200, facilitating theattachment even in the confined space. Further, since the attachmentrequires a reduced number of man-hours, a low cost optical encoder canbe obtained. Moreover, cutting the wiring substrate 106 and opticaltransmitting material 118 together prevents unnecessary protrusion ofthe light transmitting material 118, thereby obtaining a small-sizedoptical encoder.

It goes without saying that respective configurations of the firstembodiment can be variously modified and changed.

For example, the number of light sources 102 and photodetectors 104 isnot limited to one, but a plurality of the light sources 102 andphotodetectors 104 may be mounted. The number of types of the gratingpatterns is not limited to one, but a plurality of types of the gratingpatterns may be formed on the scale 200. A circuit that converts ananalog signal into a digital signal, an incorporated divider circuit, ora light source driver may be mounted on the semiconductor IC 108, inaddition to the photodetector 104. As the method of electricallyconnecting the semiconductor IC 108 to the wiring substrate 106, theremay be available a method of forming a wiring on the rear side of thesemiconductor IC 108 and the wiring is connected to the wiring substrate106 by soldering, in addition to the method using conductive wires 110.Further, not only one side plane, but also two side planes perpendicularto each other can be used as a reference position, that is, a side plane120, related to disposition of the components mounted on the wiringsubstrate 106. Moreover, an optical slit may be formed on the lightsource 102.

Second Embodiment

As shown in FIG. 6, an optical encoder according to a second embodimentis a reflective optical encoder including a sensor head 100 having alight source 102 and a photodetector 104 inside thereof, and a scale 200having a grating pattern and configured to move in a straight linerelative to the sensor head 100.

The sensor head 100 includes, as shown in FIGS. 6 and 7, a wiringsubstrate 106 made of ceramics, resin, or the like having electrodes anda semiconductor IC 108 having one or more photodetectors 104 formedthereon. The semiconductor IC 108 is mounted on the wiring substrate106. The light source 102 such as an LED or semiconductor laser is alsomounted on the semiconductor IC 108. Other configurations are the sameas those of the first embodiment, and the descriptions thereof will beomitted.

The method of manufacturing the sensor head 100 and attachment betweenthe sensor head 100 and scale 200 having a grating pattern are the sameas those of the first embodiment, and will not, therefore, be explainedfurther.

The second embodiment can obtain the same effect as that obtained in thefirst embodiment. Further, since the light source 102 is mounted on thesemiconductor IC 108, the second embodiment has a particular effect thata further reduction in the size of the optical encoder can be achieved.

The same modifications and variations as those in the first embodimentcan be made to the configurations of the second embodiment.

Third Embodiment

As shown in FIG. 8, an optical encoder according to a third embodimentis a reflective optical encoder including a sensor head 100 having alight source 102 and a photodetector 104 inside thereof, and a scale 200having a grating pattern and configured to move in a straight linerelative to the sensor head 100.

A difference between the third embodiment and the aforementioned firstembodiment is that lead electrodes 114 are not exposed outside at theside surfaces of the sensor head 100, as shown in FIGS. 8 and 9. Otherconfigurations of the sensor head 100, the manufacturing method thereof,and attachment between the sensor head 100 and scale 200 are the same asthose of the first embodiment, and will not, therefore, be explainedfurther.

The third embodiment can obtain the same effect as that obtained in thefirst embodiment. Further, since electrodes are exposed outside only onthe rear side of the sensor head 100, the third embodiment has aparticular effect that reliability of electrical connection against theexternal environment can be increased.

The same modifications and variations as those in the first embodimentcan be made to the configurations of the third embodiment.

Fourth Embodiment

As shown in FIG. 10, an optical encoder according to a fourth embodimentis a reflective optical encoder including a sensor head 100 having alight source 102 and a photodetector 104 inside thereof, and a scale 200having a grating pattern and configured to move in a straight linerelative to the sensor head 100.

The sensor head 100 includes, as shown in FIGS. 10 and 11, a wiringsubstrate 106, a light source 102, a semiconductor IC 108, a lighttransmitting material 118, electrical wirings (surface electrodes 112,lead electrodes 114, rear surface electrodes 116), and a side plane 120.The above components are identical to those in the aforementioned firstembodiment. In addition to the above components, the sensor head 100according to the fourth embodiment includes a light transmitting plate126 made of glass or the like. The light transmitting plate 126 isplaced on the light transmitting material 118 in such a manner to coverthe light source 102 and photodetector 104.

The manufacturing method of the sensor head 100 is the same as that usedin the first embodiment except for processes related to the lighttransmitting plate 126. That is, after the light transmitting material118 made of transparent resin or the like has been dropped by potting orthe like, the light transmitting plate 126 made of glass or the like isso placed on the light transmitting material 118 as to cover the lightsource 102 and photodetector 104. Then the light transmitting material118 is solidified while the light transmitting plate 126 is bonded tothe light transmitting material 118. Finally, the large-sized substrate122 is cut, together with the light transmitting material 118, along thereference cutting-plane line 124 in the direction substantiallyperpendicular to the light receiving surface of the photodetector 104formed on the semiconductor IC 108, thereby obtaining the sensor head100 having the side plane 120. The side plane 120 formed by the abovemanufacturing method serves as a reference position for the componentsto be mounted on the wiring substrate 106.

The light transmitting plate 126 should be disposed on the lightemitting surface at which the light related to the displacement signalthat has been emitted from the light source 102 is emitted from thesensor head 100 and the light incident surface at which the lightrelated to the displacement signal that has been reflected or diffractedby the scale 200 is incident on the sensor head 100. It is preferablethat the light transmitting plate 126 be disposed parallel to thesurface of a grating pattern formed on the scale 200. Further, anoptical slit may be formed on the light transmitting plate 126.Moreover, the light transmitting plate 126 may be in close contact withthe semiconductor IC 108.

The attachment between the sensor head 100 thus manufactured and scale200 having a grating pattern is the same as that of the firstembodiment, and will not, therefore, be explained further.

The fourth embodiment can obtain the same effect as that obtained in thefirst embodiment. Further, since the light emitting and light incidentsurfaces of the sensor head 100 are realized by one plane, diffractionof the emitted light and incident light at the surface of the sensorhead 100 becomes stable, so that a low noise light, that is, a lightwith high signal-to-noise ratio enters the photodetector 104. Therefore,a displacement signal with high accuracy can be obtained and thereby ahigh resolution optical encoder can be obtained.

The same modifications and variations as those in the first embodimentcan be made to the configurations of the fourth embodiment.

Further, the following method may be employed to manufacture the sensorhead 100. That is, after a large-sized light transmitting plate 126 isbonded to the light transmitting material 118, the large-sized substrate122 and large-sized light transmitting plate 126 are cut together withthe light transmitting material 118 along the reference cutting-planeline 124 in the direction substantially perpendicular to the lightreceiving surface of the photodetector 104 formed on the semiconductorIC 108.

Fifth Embodiment

As shown in FIG. 12, an optical encoder according to a fifth embodimentis a reflective optical encoder including a sensor head 100 having alight source 102 and a photodetector 104 inside thereof, and a scale 200having a grating pattern and configured to move in a straight linerelative to the sensor head 100.

The sensor head 100 includes, as shown in FIGS. 12 and 13, a wiringsubstrate 106, a light source 102, a semiconductor IC 108, a lighttransmitting material 118, electrical wirings (surface electrodes 112,lead electrodes 114, rear surface electrodes 116), and a side plane 120.The above components are identical to those in the aforementioned firstembodiment. Further, in the fifth embodiment, a flat surface 128 of thelight transmitting material 118 serves both as the light emittingsurface at which the light related to the displacement signal that hasbeen emitted from the light source 102 is emitted therefrom and thelight incident surface at which the light related to the displacementsignal that has been reflected or diffracted by the scale 200 isincident thereon.

The manufacturing method of the sensor head 100 is the same as that usedin the first embodiment except for processes related to the flat surface128 of the light transmitting material 118. That is, after the surfaceof the sensor head 100 has been covered by the light transmittingmaterial 118 made of transparent resin or the like, the upper surface ofthe light transmitting material 118 is smoothed or polished to obtainthe flat surface 128 serving as the light emitting surface at which thelight related to the displacement signal that has been emitted from thelight source 102 is emitted therefrom and the light incident surface atwhich the light related to the displacement signal that has beenreflected or diffracted by the scale 200 is incident thereon. Finally,the large-sized substrate 122 is cut, together with the lighttransmitting material 118, along the reference cutting-plane line 124 inthe direction substantially perpendicular to the light receiving surfaceof the photodetector 104 formed on the semiconductor IC 108, therebyobtaining the sensor head 100 having the side plane 120. The side plane120 formed by the above manufacturing method serves as the referenceposition for the components to be mounted on the wiring substrate 106.

The flat surface 128 of the light transmitting material 118 maycompletely correspond to the light emitting surface at which the lightrelated to the displacement signal that has been emitted from the lightsource 102 is emitted therefrom and the light incident surface at whichthe light related to the displacement signal that has been reflected ordiffracted by the scale 200 is incident thereon. It is preferable thatthe flat surface 128 of the light transmitting material 118 be parallelto the surface of a grating pattern formed on the scale 200.

The attachment between the sensor head 100 thus manufactured and scale200 having a grating pattern is the same as that of the firstembodiment, and will not, therefore, be explained further.

The fifth embodiment can obtain the same effect as that obtained in thefourth embodiment.

The same modifications and variations as those in the first embodimentcan be made to the configurations of the fifth embodiment.

Sixth Embodiment

As shown in FIG. 14, an optical encoder according to the sixthembodiment is a reflective optical encoder including a sensor head 100having a light source 102 and a photodetector 104 inside thereof, and ascale 200 having a grating pattern and configured to move in a straightline relative to the sensor head 100.

The sensor head 100 includes, as shown in FIGS. 14 and 15, a wiringsubstrate 106 made of ceramics, resin, or the like having electrodes,the light source 102 such as an LED or semiconductor laser, and asemiconductor IC 108 having photodetector 104 formed thereon. The lightsource 102 and semiconductor IC 108 are mounted on the wiring substrate106. Placed on the light emitting part of the light source 102 and thelight detection surface of the photodetector 104 are light transmittingmaterials 130 and 132, respectively. The light source 102 andsemiconductor IC 108 are electrically connected to surface electrodes112 of the wiring substrate 106 by conductive wires 110, respectively.Each of the surface electrodes 112 is electrically connected to a rearsurface electrode 116 through a lead electrode 114. In the case whereelectrodes are formed on the reverse side of the light source 102, theyare electrically connected to the surface electrodes 112 of the wiringsubstrate 106, by soldering or using conductive paste. The conductivewires 110 and surface electrodes 112 of the wiring substrate 106 arecovered by insulating resins 134. Further, the sensor head 100 has aside plane 120 substantially perpendicular to the light receivingsurface of the photodetector 104 on the reference position related todisposition of the components mounted on the wiring substrate 106.

A method of manufacturing the sensor head 100 will be described.

As shown in FIGS. 16 and 17, a number of electrodes (surface electrodes112, lead electrodes 114, and rear surface electrodes 116) of the wiringsubstrate 106 are arranged in a matrix on a large-sized substrate 122made of ceramics or resin with the reference cutting-plane line 124 setas a reference position. Further, the components to be mounted on thewiring substrate 106, such as a light source 102 having the lighttransmitting material 130 disposed on the light emitting part thereofand semiconductor IC 108 having the light transmitting material 132disposed on the light detection surface thereof are mounted at desiredpositions on the large-sized substrate 122 with the referencecutting-plane line 124 serving as a reference position. The lighttransmitting materials 130 and 132 may be disposed on the light source102 and semiconductor IC 108 after the light source 102 andsemiconductor IC 108 have been mounted on the wiring substrate 106.Further, each of the light transmitting materials 130 and 132 may be alight transmitting plate made of glass. For formation of the leadelectrodes 114, a method in which through holes are drilled in thelarge-sized substrate 122 and conductive materials are placed in thethrough holes is available, for example. After the light source 102 andsemiconductor IC 108 are electrically connected to the surfaceelectrodes 112 of the wiring substrate 106 by conductive wires 110 orthe like, the conductive wires 110 and wiring substrate 106 are coveredby the insulating resins 134. Finally, the large-sized substrate 122 iscut, together with the insulating resins 134, along the referencecutting-plane line 124 in the direction substantially perpendicular tothe light receiving surface of the photodetector 104 formed on thesemiconductor IC 108, thereby obtaining the sensor head 100 having theside plane 120. The side plane 120 formed by the above manufacturingmethod serves as a reference position for disposition of the componentsto be mounted on the wiring substrate 106.

The attachment between the sensor head 100 thus manufactured and scale200 having a grating pattern is the same as that of the firstembodiment, and will not, therefore, be explained further.

The sixth embodiment can obtain the same effect as that obtained in thefirst embodiment.

The same modifications and variations as those in the first embodimentcan be made to the configurations of the sixth embodiment.

The insulating resins 134 may be a light shielding material.

Seventh Embodiment

As shown in FIG. 18, an optical encoder according to a seventhembodiment is a reflective optical encoder including a sensor head 100having a light source 102 and a photodetector 104 inside thereof, and ascale 200 having a grating pattern and configured to move in a straightline relative to the sensor head 100.

The sensor head 100 includes, as shown in FIGS. 18 and 19, a wiringsubstrate 106 made of ceramics, resin, or the like having electrodes,the light source 102 such as an LED or semiconductor laser and asemiconductor IC 108 having photodetector 104 formed thereon. The lightsource 102 and semiconductor IC 108 are mounted on the wiring substrate106. Placed on the light emitting part of the light source 102 is alight transmitting material 130. The light source 102 and semiconductorIC 108 are electrically connected to surface electrodes 112 of thewiring substrate 106 by conductive wires 110, respectively. Each of thesurface electrodes 112 is electrically connected to a rear surfaceelectrode 116 through a lead electrode 114. In the case where electrodesare formed on the reverse side of the light source 102, they areelectrically connected to the surface electrodes 112 of the wiringsubstrate 106, by soldering or using conductive paste. The area on thewiring substrate 106, including the light detection surface of thephotodetector 104 and the conductive wires 110, is covered by alight-transmitting insulating material 136 such as transparent resin.Further, the sensor head 100 has a side plane 120 substantiallyperpendicular to the light receiving surface of the photodetector 104 ona reference position related to disposition of the components mounted onthe wiring substrate 106.

Next, a method of manufacturing the sensor head 100 will be described.

Firstly, a number of electrodes (surface electrodes 112, lead electrodes114, and rear surface electrodes 116) of the wiring substrate 106 arearranged in a matrix on a large-sized substrate 122 made of ceramics orresin with the reference cutting-plane line 124 serving as a referenceposition. Further, the components to be mounted on the wiring substrate106, such as a light source 102 having the light transmitting material130 disposed on the light emitting part thereof and semiconductor IC108, are mounted at desired positions with the reference cutting-planeline 124 serving as a reference position. For formation of the leadelectrodes 114, a method in which through holes are drilled in thelarge-sized substrate 122 and conductive materials are placed in thethrough holes is available, for example. After the light source 102 andsemiconductor IC 108 are electrically connected to the surfaceelectrodes 112 of the wiring substrate 106 by conductive wires 110 orthe like, respectively, the area on the wiring substrate 106, includingthe light detection surface of the photodetector 104 and the conductivewires 110 is covered by a light-transmitting insulating material 136such as transparent resin. Finally, the large-sized substrate 122 iscut, together with the light-transmitting insulating material 136, alongthe reference cutting-plane line 124 in the direction substantiallyperpendicular to the light receiving surface of the photodetector 104formed on the semiconductor IC 108, thereby obtaining the sensor head100 having the side plane 120. The side plane 120 formed by the abovemanufacturing method serves as the reference position for the componentsto be mounted on the wiring substrate 106.

The attachment between the sensor head 100 thus manufactured and scale200 having a grating pattern is the same as that of the firstembodiment, and will not, therefore, be explained further.

The seventh embodiment can obtain the same effect as that obtained inthe first embodiment.

The same modifications and variations as those in the first embodimentcan be made to the configurations of the seventh embodiment.

Eighth Embodiment

As shown in FIG. 20, an optical encoder according to an eighthembodiment is a reflective optical encoder including a sensor head 100having a light source 102 and a photodetector 104 inside thereof, and ascale 200 having a grating pattern and configured to move in a straightline relative to the sensor head 100.

The sensor head 100 includes, as shown in FIGS. 20 and 21, a wiringsubstrate 106 made of ceramics, resin, or the like having electrodes,the light source 102 such as an LED or semiconductor laser and asemiconductor IC 108 having a photodetector 104 formed thereon. Thelight source 102 and semiconductor IC 108 are mounted on the wiringsubstrate 106. The light source 102 and photodetector 104 are directlycovered by one light transmitting plate 138. The light source 102 andsemiconductor IC 108 are electrically connected to surface electrodes112 of the wiring substrate 106 by conductive wires 110, respectively.Each of the surface electrodes 112 is electrically connected to a rearsurface electrode 116 through a lead electrode 114. In the case whereelectrodes are formed on the reverse side of the light source 102, theyare electrically connected to the surface electrodes 112 of the wiringsubstrate 106, by soldering or using conductive paste. The conductivewires 110 and surface electrodes 112 of the wiring substrate 106 arecovered by insulating resins 134. Further, the sensor head 100 has aside plane 120 substantially perpendicular to the light receivingsurface of the photodetector 104 on the reference position related tothe components mounted on the wiring substrate 106.

A method of manufacturing the sensor head 100 will be described.

Firstly, a number of electrodes (surface electrodes 112, lead electrodes114, and rear surface electrodes 116) of the wiring substrate 106 arearranged in a matrix on a large-sized substrate 122 made of ceramics orresin with the reference cutting-plane line 124 serving as a referenceposition. Further, the components to be mounted on the wiring substrate106, such as a light source 102 and semiconductor IC 108, are mounted atdesired positions with the reference cutting-plane line 124 set as areference position. For formation of the lead electrodes 114, a methodin which through holes are drilled in the large-sized substrate 122 andconductive materials are placed in the through holes is available, forexample. The light transmitting plate 138 made of glass or the like isso disposed as to cover the photodetector 104 and light source 102. Amethod in which an optical slit or alignment mark formed on the lighttransmitting plate 138 is aligned with the shape of the photodetector104 is available. After the light source 102 and semiconductor IC 108are electrically connected to the surface electrodes 112 of the wiringsubstrate 106 by conductive wires 110 or the like, respectively, theconductive wires 110 and wiring substrate 106 are covered by theinsulating resins 134. Finally, the large-sized substrate 122 is cut,together with the insulating resins 134, along the referencecutting-plane line 124 in the direction substantially perpendicular tothe light receiving surface of the photodetector 104 formed on thesemiconductor IC 108, thereby obtaining the sensor head 100 having theside plane 120. The side plane 120 formed by the above manufacturingmethod serves as the reference position for the components to be mountedon the wiring substrate 106.

The attachment between the sensor head 100 thus manufactured and scale200 having a grating pattern is the same as that of the firstembodiment, and will not, therefore, be explained further.

The eighth embodiment can obtain the same effect as that obtained in thefirst embodiment.

The same modifications and variations as those in the first embodimentcan be made to the configurations of the eighth embodiment.

Additional advantages and modifications will readily occur to thoseskilled in the art. Therefore, the invention in its broader aspects isnot limited to the specific details, representative devices, andillustrated examples shown and described herein. Accordingly, variousmodifications may be made without departing from the spirit or scope ofthe general inventive concept as defined by the appended claims andtheir equivalents.

1. (canceled)
 2. An optical encoder comprising: a sensor head including: at least one light source; and at least one photodetector having a light receiving surface; and a scale that moves relative to the sensor head, wherein the light emitted from the light source is reflected, transmitted or diffracted by the scale, and the reflected, transmitted or diffracted tight is received by the photodetector to allow the sensor head to output a displacement signal, wherein the scale comprises a positioning section configured to be used for disposing the sensor head such that positional relationship between the scale and the sensor head becomes a predetermined position, and the sensor head comprises: a wiring substrate having a surface which faces the scale and a rear surface which is on the reverse side thereof, surface electrodes formed on the surface and rear surface electrodes formed on the rear surface, and at least either the light source and the photodetector provided on the surface; a light transmitting material molded by resin seal being at least a part on a surface of the wiring substrate and covering at least either the light source and the photodetector; and at least one of side planes obtained by cutting the wiring substrate and the light transmitting material at the same time in a direction perpendicular to the light receiving surface of the photodetector, wherein at least either the light source and the photodetector is in a predetermined positional relationship with the side plane, and by aligning the positioning section of the scale and the side planes of the sensor head with each other, the positional relationship between the scale and at least either the light source and the photodetector disposed on the wiring substrate becomes a predetermined position.
 3. The encoder according to claim 2, wherein the positioning section provided on the scale is an outer plane or an alignment pattern perpendicular to the long side of a grating pattern of the scale.
 4. The encoder according to claim 3, wherein the photodetector is a semiconductor IC with a circuit.
 5. The encoder according to claim 4, wherein the light source is disposed on the semiconductor IC.
 6. The encoder according to claim 3, wherein an electrical connection between surface electrodes and rear surface electrodes of the wiring substrate is formed on the wiring substrate excluding the side plane.
 7. The encoder according to claim 6, wherein through holes are drilled in the wiring substrate and the electrodes are placed in the through holes.
 8. The encoder according to claim 3, wherein the photodetector is disposed on the wiring substrate so that the long side of the photodetector becomes perpendicular to the side plane.
 9. The encoder according to claim 8, wherein the photodetector is a semiconductor IC with a circuit.
 10. The encoder according to claim 9, wherein the light source is disposed on the semiconductor IC.
 11. The encoder according to claim 8, wherein an electrical connection between surface electrodes and rear surface electrodes of the wiring substrate is formed on the wiring substrate excluding the side plane.
 12. The encoder according to claim 11, wherein through holes are drilled in the wiring substrate and the electrodes are placed in the through holes. 